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A Study on the Effect of Process Parameters on Surface Topography of Al Thin Films on Various Substrates Using AFM

Journal Advanced Materials Research (Volumes 383 - 390)
Volume Manufacturing Science and Technology
Edited by Wu Fan
Pages 903-908
DOI 10.4028/www.scientific.net/AMR.383-390.903
Citation S. Shanmugan et al., 2011, Advanced Materials Research, 383-390, 903
Online since November, 2011
Authors S. Shanmugan, D. Mutharasu, Z. Hassan, H. Abu. Hassan
Keywords Al Thin Film, Particle Size, Sruface Roughness, Surface Topography
Abstract

Al thin films were prepared over different substrates at various process conditions using DC sputtering. The surface topography of all prepared films was examined using AFM technique. Very smooth, uniform and dense surface were observed for Al films coated over Glass substrates. The observed particle size was nano scale (20 -70 nm) for Glass substrates. Sputtering power showed immense effect on surface roughness with respective to Ar gas flow rate. Noticeable change on surface with large particles was observed in Copper substrates at various sputtering power and gas flow rate.

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