Paper Title:
Adhesion Property of Copper Paste on Ceramic Radiator Fins
  Abstract

Ceramic radiator fins were produced by screen-printing copper paste on ceramic substrate, which could replace the traditional technique of direct bestrow copper and meet the requirements of surface mounted technology. This method could be used to manufacture high density, superior thin and micro-sized molectrons. The key processes were screen-printing copper paste, sintering and electroless plating of nickel. The adhesion of copper film onto the ceramic substrate was often reduced after the process of electroless plating of nickel, resulting in the low quality of manufacturing. In this study, we analyzed the ceramic radiator fins which were obtained by the screen-printing copper paste method and using scanning electron microscopy to examine the surface and the cross-sections of copper film and Cu/Ni film. The adhesive properties of copper film during electroless plating was studied. The corrosion resistance of copper film and sintering glass phase on alumina substrate (96%) was also studied in an electroplating bath. The study revealed that the glass phase of acidity of silicon, softening temperature, the interaction conjunction between glass phase and ceramics were important factors.

  Info
Periodical
Advanced Materials Research (Volumes 41-42)
Edited by
Xiaozhi Hu, Brent Fillery, Tarek Qasim and Kai Duan
Pages
215-220
DOI
10.4028/www.scientific.net/AMR.41-42.215
Citation
X. Y. Zhu, J. M. Long, X. W. Yang, "Adhesion Property of Copper Paste on Ceramic Radiator Fins", Advanced Materials Research, Vols. 41-42, pp. 215-220, 2008
Online since
April 2008
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Price
$32.00
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