Laser-Induced Electroless Copper Deposition on Modified Plastic Surface
| Periodical | Advanced Materials Research (Volumes 424 - 425) |
|---|---|
| Main Theme | Advanced Research on Engineering Materials, Energy, Management and Control |
| Edited by | Helen Zhang and David Jin |
| Pages | 765-769 |
| DOI | 10.4028/www.scientific.net/AMR.424-425.765 |
| Citation | Xiao Peng et al., 2012, Advanced Materials Research, 424-425, 765 |
| Online since | January, 2012 |
| Authors | Xiao Peng, Kai Yong Jiang |
| Keywords | Adhesive Strength, Electroless Copper Deposition, Laser Induced, Resistance |
| Price | US$ 28,- |
Metallization treating on the plastic surface without the mask technology was created by using a new method combining the laser technique with the electroless copper deposition,this method get rid of palladium as catalyzer in the traditional chemical plating which is high cost and environment unfriendly. The samples are examined carefully by the scanning electron microscopy; resistance and adherence of the Cu plating were inspected and analysised. The result indicated that it was feasible to fabricate compact,uniform,and good conductive Cu plating on the plastic substrate by using potassium sodium tartrate and EDTA2Na as chelating agent; the resistivity of plating is related to the deposition time; adherence is influenced by laser power,the excellent adherence to plastics surface are obtained when the laser power exceeds 5W.
