Paper Title:
Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package
  Abstract

A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.

  Info
Periodical
Advanced Materials Research (Volumes 44-46)
Edited by
Z.Y. Shen, M.N. James, W.D. Li, and Y.X. Zhao
Pages
77-84
DOI
10.4028/www.scientific.net/AMR.44-46.77
Citation
W. N. Hao, G. Z. Chai, J. Zhou, "Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package ", Advanced Materials Research, Vols. 44-46, pp. 77-84, 2008
Online since
June 2008
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Price
$32.00
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