Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package |
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| Journal | Advanced Materials Research (Volumes 44 - 46) |
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| Volume | Materials and Product Technologies |
| Edited by | Z.Y. Shen, M.N. James, W.D. Li, and Y.X. Zhao |
| Pages | 77-84 |
| DOI | 10.4028/www.scientific.net/AMR.44-46.77 |
| Citation | Wei Na Hao et al., 2008, Advanced Materials Research, 44-46, 77 |
| Online since | June, 2008 |
| Authors | Wei Na Hao, Guo Zhong Chai, J. Zhou |
| Keywords | CBGA Package, Damage Constitutive Model, Lead-Free Solder, Thermomechanical Fatigue (TMF) |
| Abstract | A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package. |
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