Paper Title:
A Kinetic Study on the Electrodeposition of Ni-Cr Alloy on Copper for Embedded Resister Layer in PCB
  Abstract

The thin film resistors such as Ni-Cr alloy could be formed by the electrodeposition method for embedded passive device in printed circuit board. A kinetic study on the electrodeposition of nickel-chromium alloy on copper has been performed using a rotating disk geometry. Activation energies of nickel and chromium in the temperature range between 15°C and 35°C were 8.9kcal/mole and 3.5kcal/mole, respectively. The electrodeposition rate of nickel seems to be controlled partly by electrochemical reaction and partly by mass transport, namely mixed controlled. However, that of chromium seems to be controlled by mass transport. As the amount of chromium in deposit increased, the electric resistance of deposit surface increased. The maximum electric resistance of nickel-chromium alloy deposit was 78.6Ω /□.

  Info
Periodical
Advanced Materials Research (Volumes 47-50)
Edited by
Alan K.T. Lau, J. Lu, Vijay K. Varadan, F.K. Chang, J.P. Tu and P.M. Lam
Pages
754-757
DOI
10.4028/www.scientific.net/AMR.47-50.754
Citation
S. H. Son, D. W. Chung, D. C. Kwon, H. K. Lee, "A Kinetic Study on the Electrodeposition of Ni-Cr Alloy on Copper for Embedded Resister Layer in PCB ", Advanced Materials Research, Vols. 47-50, pp. 754-757, 2008
Online since
June 2008
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$32.00
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