Analysis about Infrared Thermal Imaging Detection on Building Envelope and Material Defect Cases
| Periodical | Advanced Materials Research (Volume 485) |
|---|---|
| Main Theme | Advanced Research on Material Engineering and its Application |
| Edited by | Helen Zhang and David Jin |
| Pages | 16-22 |
| DOI | 10.4028/www.scientific.net/AMR.485.16 |
| Citation | Fei Guo et al., 2012, Advanced Materials Research, 485, 16 |
| Online since | February, 2012 |
| Authors | Fei Guo, Pei Sheng Zhu, Shu Guo Liu, Shen Jian Hu |
| Keywords | Building Enclosure Defect, Engineering Quality Detection, Infrared Thermal Imaging |
| Price | US$ 28,- |
In order to explore thermal imaging technologies’ applicability in building envelope and material defection, laboratory experiments and field tests have been carried out to record typical defection thermal images in the climate of Dalian area. Based on one typical building defection case, with its thermal images and working drawing, the effect of material and constructions on the nature and reason of its defection has been carefully analyzed, which can lead us to the conclusions that external insulation construction of building envelope of tiles facing can easily cause bursting or dropping accidents in Dalian area.