Effect of Diamond on the Thermal Conductivities of Diamond-Copper Composites Prepared by Spark Plasma Sintering
| Periodical | Advanced Materials Research (Volumes 532 - 533) |
|---|---|
| Main Theme | Materials Science and Information Technology II |
| Edited by | Suozhang Cai and Mingli Li |
| Pages | 25-29 |
| DOI | 10.4028/www.scientific.net/AMR.532-533.25 |
| Citation | Ying Hu Dong et al., 2012, Advanced Materials Research, 532-533, 25 |
| Online since | June, 2012 |
| Authors | Ying Hu Dong, Rui Qing Zhang, Zhi Guo Ye |
| Keywords | Composite, Spark Plasma Sintering (SPS), Thermal Property |
| Price | US$ 28,- |
Diamond-copper composites are fabricated by spark plasma sintering (SPS). The effects of particle size, original properties and coatings of diamond on the thermal conductivity (TC) of diamond-copper composites have been investigated, respectively. The results indicate that thermal conductivity of composites enhances with an increase in particle size and original properties of diamond. Composites with Cr, Ti or Ni coatings on diamond surface appear remarkably higher TC than that which without any coatings. The improvements of TC of diamond/copper composites are mainly due to the large particle size diamond decreasing the interfacial area in composites, the high original properties diamond possessing higher original TC, and coatings on diamond surface declining the interfacial thermal resistance and improving the wetting properties between diamond and copper.