Paper Title:

The PC Main Board Static Stress Analysis Using ABAQUS

Periodical Advanced Materials Research (Volumes 538 - 541)
Main Theme Materials Processing Technology II
Edited by Liancheng Zhao, Haowei Wang and Changfa Xiao
Pages 1020-1023
DOI 10.4028/www.scientific.net/AMR.538-541.1020
Citation Xu Qin Chen et al., 2012, Advanced Materials Research, 538-541, 1020
Online since June, 2012
Authors Xu Qin Chen, Yu Qing Zheng
Keywords ABAQUS/Standard, FEA, PC Main Board, Simulation Analysis, Stress
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Abstract

This article took the PC main board as a research object and simulated how to optimize the position of the desktop main board pads. The static stress analysis was executed using ABAQ -US/Standard. The objective was to reduce the local deformation of computer main board occurs when the connector was inserted and extracted during the assembly process, preventing the chips and capacitances on the main board from becoming invalid. The simulation results showed that the FEA method with Abaqus can be used to predict the main board performance and structure optimization.