Paper Title:
The Effects of Voltage on Cu-Ce Infiltration Layer of 304 Stainless Steel by Double Glow Plasma Surface Metallurgy
| Periodical | Advanced Materials Research (Volumes 538 - 541) |
|---|---|
| Main Theme | Materials Processing Technology II |
| Edited by | Liancheng Zhao, Haowei Wang and Changfa Xiao |
| Pages | 298-301 |
| DOI | 10.4028/www.scientific.net/AMR.538-541.298 |
| Citation | Feng Tang et al., 2012, Advanced Materials Research, 538-541, 298 |
| Online since | June, 2012 |
| Authors | Feng Tang, Jin Yong Xu, Yan Tang, Cheng Gao, Peng Gao, Bo Gao, Wei Heng Mo, Yuan Ming Li |
| Keywords | Cathode Voltage, Cu-Ce Infiltration, Diffusion Layer, Source Voltage |
| Price | US$ 28,- |
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Abstract
The Cu-Ce infiltration layer was formed on 304 Stainless Steel surface by double glow plasma surface metallurgy technology. The effects of source voltage and cathode voltage on surface alloying concentration, surface hardness and infiltration layer depth were analyzed by comparative test. The results showed: In the experimental range, the contents of Cu and Ce, surface hardness, deposition layer depth increase with the source voltage increasing, which is contrary to the cathode voltage; the diffusion layer depth increases with either voltage increasing in a certain range.
