Paper Title:
TEM and SEM Analysis for Formation Mechanism of Tin Whiskers
| Periodical | Advanced Materials Research (Volume 545) |
|---|---|
| Main Theme | Advancement of Materials and Nanotechnology II |
| Edited by | Norlida Kamarulzaman |
| Pages | 16-20 |
| DOI | 10.4028/www.scientific.net/AMR.545.16 |
| Citation | Noriyuki Kuwano et al., 2012, Advanced Materials Research, 545, 16 |
| Online since | July, 2012 |
| Authors | Noriyuki Kuwano, Sadanori Horikami, Masanori Maeda, Harini Sosiati |
| Keywords | Electron Microscopy, Formation Mechanism, In Situ Observation, Stress, Tin Whisker |
| Price | US$ 28,- |
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Abstract
Close observation with a transmission electron microscope (TEM) and a scanning electron microscope (SEM) was performed for the growth process of tin (Sn) whiskers on lead (Pb)-free Sn-plating. Whiskers were formed on a Sn layer plated on Cu/polyimide flexible substrate. The whisker was found to be of a single crystal and have a characteristic "Y"-shaped grain boundary structure at its root. The growth process of a curling whisker was successfully observed in a continuous way in SEM. TEM observation revealed that the curling whisker had a single crystallographic orientation irrespective with its external shape. these microstructures indicate that the rearrangement of dislocations plays an important role in the growth process of whiskers.
