A New Palladium-Free Surface Activation Process for Cu Electroless Plating on ABS Plastic
|Periodical||Advanced Materials Research (Volume 548)|
|Main Theme||Material and Manufacturing Technology III|
|Edited by||K.M. Gupta|
|Citation||Xu Wang, 2012, Advanced Materials Research, 548, 54|
|Online since||July, 2012|
|Keywords||ABS Resin Material, Electroless Copper, Electroless Plating (EP)|
An environment-friendly surface etching and activation technics for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst. After etching by H2SO4-MnO2 colloid, the ABS surfaces became roughness; meanwhile the carboxyl and hydroxyl groups were formed on the surface. With absorption and a reduction by a dimethylamineborane solution, nickel particles were deposited on the ABS surface, which serves as a catalyst replacement for SnCl2/PdCl2 colloid. The effects of NiSO4 concentration, (CH3) 2NHBH3 concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated.