Paper Title:
A New Palladium-Free Surface Activation Process for Cu Electroless Plating on ABS Plastic
| Periodical | Advanced Materials Research (Volume 548) |
|---|---|
| Main Theme | Material and Manufacturing Technology III |
| Edited by | K.M. Gupta |
| Pages | 54-57 |
| DOI | 10.4028/www.scientific.net/AMR.548.54 |
| Citation | Xu Wang, 2012, Advanced Materials Research, 548, 54 |
| Online since | July, 2012 |
| Authors | Xu Wang |
| Keywords | ABS Resin Material, Electroless Copper, Electroless Plating (EP) |
| Price | US$ 28,- |
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Abstract
An environment-friendly surface etching and activation technics for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst. After etching by H2SO4-MnO2 colloid, the ABS surfaces became roughness; meanwhile the carboxyl and hydroxyl groups were formed on the surface. With absorption and a reduction by a dimethylamineborane solution, nickel particles were deposited on the ABS surface, which serves as a catalyst replacement for SnCl2/PdCl2 colloid. The effects of NiSO4 concentration, (CH3) 2NHBH3 concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated.
