. A baseline electroless deposition processes for Cu on CNTs has been developed. This process results in the formation of copper particles of few tens of nanometres. Using this process in a CNT loaded solution it is possible to obtain a homogeneous distribution of CNTs and Cu, even for volume fraction of CNTs as high as 17 v%. By the application of wet chemical processing it is possible to penetrate the natural felt-like structure of the CNTs and to fill the gaps with copper particles. Variations of the baseline deposition process have been established, allowing adding small amount of nickel on the CNT prior to the copper deposition to strengthen the interfacial bonding between matrix and CNTs. Hot pressing of the highly CNT loaded metal matrix composites has been developed; it allows producing bulk material that can be handled. The microstructure of these materials has been investigated and samples have been machined for further testing, i.e. mechanical characterization and thermo-physical properties.