Paper Title:

Influence of Different Deposition Parameters on the Performance of a Ti-Ta-C Interface Layer in SiC-Fiber Reinforced Copper Matrix Composites

Periodical Advanced Materials Research (Volume 59)
Main Theme 1st International Conference On New Materials for Extreme Environment
Edited by Ch. Linsmeier and M. Reinelt
Pages 138-142
DOI 10.4028/www.scientific.net/AMR.59.138
Citation Thomas Köck et al., 2008, Advanced Materials Research, 59, 138
Online since December, 2008
Authors Thomas Köck, Aurelia Herrmann, Annegret Brendel, Harald Bolt
Keywords Copper (Cu), Fiber Coating, Magnetron Sputtering, Metal Matrix Composite (MMC), Tantalum Carbide, Titanium Carbide
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Abstract

The mechanical properties of a SiC-fiber/copper matrix composite, reinforced with SCS-0 SiC-fibers ( 140µm, Specialty Materials), can significantly be increased by applying a Ti-Ta-C multilayer between fiber and matrix. This interlayer is deposited with a magnetron sputter device directly on the single fibers. By changing the deposition parameters of this sputter process the Ti-Ta-C interlayer can be optimized regarding fiber strength and fiber/matrix adhesion. Experiments with different deposition pressures, bias voltages and layer thickness’ were performed to increase the bond strength and the ultimate tensile strength when compared to the Ti-Ta-C reference sample.