Paper Title:
Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging
  Abstract

The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.

  Info
Periodical
Advanced Materials Research (Volumes 60-61)
Edited by
Xiaohao Wang
Pages
325-329
DOI
10.4028/www.scientific.net/AMR.60-61.325
Citation
J. Wu, S. X. Jia, Y. X. Wang, J. Zhu, "Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging ", Advanced Materials Research, Vols. 60-61, pp. 325-329, 2009
Online since
January 2009
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Price
$32.00
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