Paper Title:
Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC
  Abstract

There has been increased interest in the use of SiC due to its excellent physical and mechanical properties. The diamond grinding process of SiC has been largely investigated in recent years, but the interface between diamond grain and SiC in grinding has not been completely understood. In this paper, a single diamond scratching method was presented in order to insight into the interface realizing on a SRV friction and abrasion test machine using three types of diamond grains with different shapes. The results analysis for material removal and diamond grain wear mechanisms in the interacting between the diamond grain and SiC can be useful to improve the grinding process of SiC.

  Info
Periodical
Advanced Materials Research (Volumes 69-70)
Edited by
Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen
Pages
209-213
DOI
10.4028/www.scientific.net/AMR.69-70.209
Citation
Q.L. Zhao, J.Y. Chen, "Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC", Advanced Materials Research, Vols. 69-70, pp. 209-213, 2009
Online since
May 2009
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