Surface Modification of Diamond to Improve Machining Properties of Ultraviolet-Curing Wire Saw |
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| Journal | Advanced Materials Research (Volumes 69 - 70) |
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| Volume | Ultra-Precision Machining Technologies |
| Edited by | Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen |
| Pages | 24-28 |
| DOI | 10.4028/www.scientific.net/AMR.69-70.24 |
| Citation | Wei Peng et al., 2009, Advanced Materials Research, 69-70, 24 |
| Online since | May, 2009 |
| Authors | Wei Peng, F.Q. Liu, C.Y. Yao |
| Keywords | Diamond, Machining Properties, Surface Modification, Ultraviolet-Curing Wire Saw |
| Abstract | The interfacial bonding strength between ultraviolet-curing resin and diamond is a key factor affecting tool properties in manufacturing of ultraviolet-curing wire saw. Therefore, in this paper, the application of surface-modified diamond coated metal was studied in ultraviolet-curing wire saw aim at retention problem of diamond in bond. Effects of surface-modified diamond were evaluated according to model of tensile test. Furthermore, retention mechanism of diamond was analyzed according to bond theory. The experimental results prove that the machining properties and service life of ultraviolet-curing wire saw can be improved by surface modification of diamond. |
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