Paper Title:
Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw
  Abstract

The deflection of cutting wire on multi-wire saw is determined by cutting wire tension, diameter ingot feed force and some other factors, and it affects the quality of silicon wafers greatly. In this paper, the initial stage of cutting process is analyzed and modeled with three ODEs. Then the numerical solutions are solved by finding out the BVPs of each ODE. The numerical solutions showed the relationship between the deflection and the cutting parameters such as cutting wire tension, diameter and ingot feed force. This method is helpful for the further research of modeling the entire cutting process.

  Info
Periodical
Advanced Materials Research (Volumes 69-70)
Edited by
Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen
Pages
343-347
DOI
10.4028/www.scientific.net/AMR.69-70.343
Citation
R. Tang, Y.X. Dai, Y.B. Zhang, J. L. Yuan, W. L. Xiong, "Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw", Advanced Materials Research, Vols. 69-70, pp. 343-347, 2009
Online since
May 2009
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Price
$32.00
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