Paper Title:
Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate
  Abstract

To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.

  Info
Periodical
Advanced Materials Research (Volumes 69-70)
Edited by
Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen
Pages
442-445
DOI
10.4028/www.scientific.net/AMR.69-70.442
Citation
X. Lv, J. L. Yuan, Y. Y. Wang, Q. F. Deng, "Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate", Advanced Materials Research, Vols. 69-70, pp. 442-445, 2009
Online since
May 2009
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Price
$32.00
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