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An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel

Journal Advanced Materials Research (Volumes 69 - 70)
Volume Ultra-Precision Machining Technologies
Edited by Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen
Pages 98-102
DOI 10.4028/www.scientific.net/AMR.69-70.98
Citation Ke Hua Zhang et al., 2009, Advanced Materials Research, 69-70, 98
Online since May, 2009
Authors Ke Hua Zhang, Dong Hui Wen
Keywords Chemical Mechanical Polishing (CMP), Mechanical Polishing, Residual Stress, Tungsten Steel
Abstract

The interaction between the tungsten steel surface and the polishing fluid & abrasive were discussed by AFM, SEM and XRD test in order to compare the chemical performances and mechanical action of the tungsten steel polishing in the paper. The chemical mechanical polishing (CMP) and the mechanical polishing (MP) was employed, respectively. The experiments results indicated that the CMP with a higher the materials removal ratio than by MP. Because a chemical corrosion effect implies that slurries with the highest removal rate have high dissolution rate, and have a lower the residual stress, however the surface took on wrinkling.

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