High throwing power (TP) copper electroplating has become increasingly important for interconnect fabrication in IC packaging substrates and printed circuit boards (PCB) due to the demands of electronic products with high-density interconnection (HDI). In this study, the factors that influence throwing power of PCB such as plating liquid concentration, current density, organic additive composition and vibration frequency have been investigated. The results showed that, within the scope of this study, with the increase of the current density, PCB throwing power ability decreased gradually, descending grade range up to 5%. Throwing power ability gradually increased as different vibration frequency from 10s to 30s. The orthogonal experimental design was employed to investigate key factors out of all available operation parameters to influence TP. It turned out that the copper sulfate concentration of 30g/L, a current density of 5 ASF, a brightener concentration of 60ml/ kAH and the vibration frequency of 30s are advantageous to achieve best throwing power in the electrodeposition processes.