Paper Title:
Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel
  Abstract

This paper presents a method to fabricate the microfluidic devices with insulated electrodes on top and bottom sides of the channel. To form the channel containing vertically opposing electrodes, two processed substrates were bonded together with an SU-8 intermediate layer sandwiched in between. An adhesive bonding technique, at wafer level, with accurate alignment was developed. Instead of using wafer bonder, the bonding was conducted on a hotplate, which relieves the requirement on the process equipment to a great extent.

  Info
Periodical
Edited by
Selin Teo, A. Q. Liu, H. Li and B. Tarik
Pages
183-186
DOI
10.4028/www.scientific.net/AMR.74.183
Citation
L. J. Zhang, A. Bossche, "Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel", Advanced Materials Research, Vol. 74, pp. 183-186, 2009
Online since
June 2009
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Price
$32.00
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