Paper Title:
Parametric Study of Femtosecond Pulses Laser Hole Drilling of Silicon Wafer
  Abstract

Clark MXR femtosecond (fs) laser micro structuring with pulse duration of 200fs up to a wavelength of 1030nm with a nominal frequency of 1 KHz on silicon wafer was studied in air using the direct focusing technique. The three steps of laser drilling process, namely hole entrance, spatter formation and hole exit, were conducted to investigate the laser parameters such as laser power, focus position, focus lens and number of pulses and their effects on the drilling hole geometry and spatter characteristic. The results show that the minimum entrance diameter is achieved while Zf =-0.2mm. It was easier for the laser to break through the material with longer lens focus length (f=100mm). However, smaller hole was produced when the focus length was shorter. The average diameter is as small as 23µm and aspect ratio is 1:30 at laser power of 200mW.

  Info
Periodical
Edited by
Selin Teo, A. Q. Liu, H. Li and B. Tarik
Pages
273-277
DOI
10.4028/www.scientific.net/AMR.74.273
Citation
L. Jiao, E. Ng, L.M. Wee, H. Y. Zheng, "Parametric Study of Femtosecond Pulses Laser Hole Drilling of Silicon Wafer", Advanced Materials Research, Vol. 74, pp. 273-277, 2009
Online since
June 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Seong Joo Lim, Ho Joon Choi, Kyoung Hoan Na, C.H. Lee
Abstract:Experiments under a cold rotary swaging process have been conducted to investigate the dimensional characteristics of the swaged tube and...
1645
Authors: Cheng Yong Wang, M.D. Chen, P.X. Yang, Jing Ming Fan
Abstract:Abrasive Suspension Jets (ASJ) is a new micro processing technique developed for micro processing of hard and brittle materials based on the...
381
Authors: Ruben Gil, J.A. Sánchez, N. Ortega, S. Plaza, B. Izquierdo, I. Pombo
Abstract:Abstract. This paper analyses the technological capabilities of a novel rotary (EDM) electrical discharge machining process for the...
247
Authors: Zhang Dong Li, Bo Zhao
Abstract:This paper proposes to use a method of ultrasonic milling on the composite materials processing, we mainly studies the effect of the length...
429
Authors: Xin Li Tian, Bao Guo Zhang, Ke Ling Lin, Fu Qiang Li, Fang Guo
Chapter 2: Precision & Ultra-Precision Machining
Abstract:Micro-detonation of striking arc machining (MDSAM) is a new machining technology for engineering ceramics rough machining. In the paper, the...
97