Paper Title:
Thermal Management and Alignment Strategies in MEMS Tunable Laser Packaging
| Periodical | Advanced Materials Research (Volume 74) |
|---|---|
| Main Theme | NEMS/MEMS Technology and Devices - ICMAT2009 |
| Edited by | Selin Teo, A. Q. Liu, H. Li and B. Tarik |
| Pages | 319-322 |
| DOI | 10.4028/www.scientific.net/AMR.74.319 |
| Citation | Ji Fang Tao et al., 2009, Advanced Materials Research, 74, 319 |
| Online since | June, 2009 |
| Authors | Ji Fang Tao, Jonathan Tamil, Jian Wu, Kun Xu, Jin Tong Lin, Ai Qun Liu |
| Keywords | Micro-Electromechanical System (MEMS), Optical Alignment, Packaging, Thermal Management, Tunable Laser |
| Price | US$ 28,- |
View full size
Abstract
A packaging architecture is developed for MEMS tunable laser (MEMS-TL). The hybrid integration of chips is realized under high accuracy thermal control and precise alignment. The thermal conductivity of the laser chip has been improved up to 60% by the proper substrate design of device and epi-down bonding method. Under the analysis of heat flux, we employ a thermo-electric cooler (TEC) to stabilize the temperature. The substrate is designed to accommodate gain chips with minimal active optical alignment, thus reducing the packaging cost. With this packaging scheme, the insertion loss is greatly induced less than 1 dB due to the advantages of horizontal and vertical alignment in optical fiber fastening and laser diode bonding.
