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Simulation of Planarization of Rectangular Glass Plate Using Tool-Path-Control-Type Polishing

Journal Advanced Materials Research (Volumes 76 - 78)
Volume Advances in Abrasive Technology XII
Edited by Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa
Pages 313-318
DOI 10.4028/www.scientific.net/AMR.76-78.313
Online since June, 2009
Authors Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
Keywords High-Flatness Polishing, LCD, Photo Mask, Planarization, Polishing Simulation, Rectangular Glass
Abstract The size of the photo mask and mother glass used in liquid crystal display production has increased yearly. Large rectangular glass plates are difficult to planarize using rotary-type polishing machines. We have developed a rotary-type polishing machine with tool path control that is optimized by polishing simulation for a rectangular wafer. The present paper describes the planarization of a rectangular plate by simulation. The influence of tool size and the aspect ratio of the rectangular plate on the flatness are clarified. For a square plate, the flatness obtained under optimized oscillation speed is less than a quarter of that obtained under uniform oscillation speed. For rectangular plates with aspect ratios of 1:1.25 and 1:1.5, planarization using a tool having a diameter equal to half the diagonal length of the plate is shown to be difficult because the stock removal distributions in diagonal and short side of the workpiece become the different shape.
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