Nanoscratching-Induced Phase Tansformation of Monocrystalline Silicon – The Depth-of-Cut Effect |
| Journal |
Advanced Materials Research (Volumes 76 - 78) |
| Volume |
Advances in Abrasive Technology XII |
| Edited by |
Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa |
| Pages |
387-391 |
| DOI |
10.4028/www.scientific.net/AMR.76-78.387 |
| Online since |
June, 2009 |
| Authors |
Kausala Mylvaganam, Liang Chi Zhang |
| Keywords |
Molecular Dynamic, Phase Transformation, Scratching, Silicon |
| Abstract |
This paper explores the effect of the depth-of-cut of an indenter on the phase transformations during nanoscratching on monocrystalline silicon on the Si(100) orientation. The analysis was carried out by molecular dynamics simulations. It was found that the depth-of-cut and the impingement direction of the indenter had a significant influence on the phase transformations in the initial impression region. At a relatively low depth-of-cut, only amorphous silicon was formed on the scratched surface. When the indenter impinged on a silicon surface with an angle, a bct5-Si crystalline phase in the initial impression region would emerge. |
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