Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer |
| Journal |
Advanced Materials Research (Volumes 76 - 78) |
| Volume |
Advances in Abrasive Technology XII |
| Edited by |
Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa |
| Pages |
428-433 |
| DOI |
10.4028/www.scientific.net/AMR.76-78.428 |
| Online since |
June, 2009 |
| Authors |
H. Takahashi, Y.B. Tian, J. Sasaki, Jun Shimizu, Li Bo Zhou, Y. Tashiro, Hisao Iwase, Sumio Kamiya |
| Keywords |
Chemo-Mechanical Grinding (CMG), Grinding Wheel, Material Removal Rate (MRR), Roughness, Silicon Wafer |
| Abstract |
Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. An encountered issue in current CMG process of Silicon (Si) wafers is metallic contaminations on ground Si wafer surface, which is attributed to the existence of sodium carbonate in wheel compounds. In this paper, four different CMG wheels were developed and grinding experiments were conducted to study the effects of exclusion of sodium carbonate and concentration of ceria abrasive on grinding performance. The grinding characteristics of the four wheels were analysized and discussed to reveal the effects of different compositions. |
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