Paper Title:
Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer
  Abstract

Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. An encountered issue in current CMG process of Silicon (Si) wafers is metallic contaminations on ground Si wafer surface, which is attributed to the existence of sodium carbonate in wheel compounds. In this paper, four different CMG wheels were developed and grinding experiments were conducted to study the effects of exclusion of sodium carbonate and concentration of ceria abrasive on grinding performance. The grinding characteristics of the four wheels were analysized and discussed to reveal the effects of different compositions.

  Info
Periodical
Advanced Materials Research (Volumes 76-78)
Edited by
Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa
Pages
428-433
DOI
10.4028/www.scientific.net/AMR.76-78.428
Citation
H. Takahashi, Y.B. Tian, J. Sasaki, J. Shimizu, L. B. Zhou, Y. Tashiro, H. Iwase, S. Kamiya, "Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer", Advanced Materials Research, Vols. 76-78, pp. 428-433, 2009
Online since
June 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ju Long Yuan, Yi Yang, Zhi Wei Wang, Dong Qiang Yu, Miao Qian, Yong Dai
Abstract:This work aims to obtain fine surface of silicon wafer during precision and ultra precision machining, and presents a new method called...
173
Authors: Shang Gao, Ren Ke Kang, Y. Li, Hang Gao
Abstract:Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on...
1
Authors: Heng Zhen Dai, Zhu Ji Jin, Shang Gao, Z.C. Tao
Chapter 1: Grinding Technology
Abstract:Aiming at the severe surface/subsurface damage of Al2O3ceramic ground by diamond grinding wheel, the...
270
Authors: Zhi Gang Dong, Shang Gao, P. Zhou, Ren Ke Kang, Dong Ming Guo
Chapter 1: Grinding and Grinding Wheels
Abstract:In order to improve the surface quality of sapphire substrates ground by diamond wheel, the chemo-mechanical grinding (CMG) tools for...
105
Authors: Ke Wu, Naoki Yamazaki, Yutaro Ebina, Li Bo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima, Takashi Fujiwara
Chapter 5: Chemical Mechanical Polishing, Processing of Semiconductor Wafer
Abstract:Finishing process of sapphire wafer is meeting huge challenge to fulfill the strict requirement of high surface quality in semiconductor...
311