Paper Title:
Modeling and Analysis of Effects of Machine Tool Stiffness and Cutting Path Density on Infeed Surface Grinding of Silicon Wafer
  Abstract

Many models [1-3] have been proposed to study the infeed grinding of Si wafers and to understand its effects on the surface generation. However, most exiting models are based on 2D/3D kinematical analysis of the wheel or its cutting edges, thus unable to suggest the behavior at the interface of wheel/substrate including effects of the elastic deformation and the cutting path density. In this paper, a new grinding model of capable to incorporate the machine tool stiffness and the substrate contact rigidity has been developed. By taking the effect of cutting path density into account, this model is able to give a better explanation of interference between the cutting edge and substrate, and the geometrical profile generated in an infeed grinding scheme.

  Info
Periodical
Advanced Materials Research (Volumes 76-78)
Edited by
Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa
Pages
445-450
DOI
10.4028/www.scientific.net/AMR.76-78.445
Citation
L. B. Zhou, T. Mitsuta, J. Shimizu, T. Tajima, "Modeling and Analysis of Effects of Machine Tool Stiffness and Cutting Path Density on Infeed Surface Grinding of Silicon Wafer", Advanced Materials Research, Vols. 76-78, pp. 445-450, 2009
Online since
June 2009
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Price
$32.00
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