Paper Title
Page
Authors: Cheng Yi Shih, Pei Lum Tso, James C. Sung
Abstract:Current polishing pads cannot polish a workpiece without using slurry with free abrasive. The new slurry is required to be continually poured...
410
Authors: Viboon Tangwarodomnukun, Jun Wang
Abstract:Laser micromachining has been widely used for micro-component fabrication of various materials, such as silicon substrates where silicon...
416
Authors: Chao Chang A. Chen, Bing Lin Kuo, Jiun Shuo Liang
Abstract:Multi-wire sawing process with slurry has been popularly adopted for wafer slicing of silicon substrates for solar cells. This paper is to...
422
Authors: H. Takahashi, Y.B. Tian, J. Sasaki, Jun Shimizu, Li Bo Zhou, Y. Tashiro, Hisao Iwase, Sumio Kamiya
Abstract:Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. An encountered issue in...
428
Authors: Y.B. Tian, Li Bo Zhou, Jun Shimizu, H. Sato, Ren Ke Kang
Abstract:The demand for extremely-thin Si wafers is expanding. Current manufacturing technologies are meeting great challenges with the continuous...
434
Authors: Hirofumi Hidai, Taro Sugita, Hitoshi Tokura
Abstract:Polycrystalline ingot slicing by wire electric discharge machining (W-EDM) has been investigated to reduce kerf loss and wafer thickness. In...
440
Authors: Li Bo Zhou, Takahito Mitsuta, Jun Shimizu, Takuji Tajima
Abstract:Many models [1-3] have been proposed to study the infeed grinding of Si wafers and to understand its effects on the surface generation. ...
445
Authors: Ji Wang Yan, Sei Ya Muto, Tsunemoto Kuriyagawa
Abstract:Ultraprecision diamond-ground silicon wafers were irradiated by a high-frequency nanosecond pulsed Nd:YAG laser equipped on a four-axis...
451
Authors: Jae Won Baik, Chang Wook Kang
Abstract:Chemical mechanical polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process...
459
Authors: Dennis V. de Pellegrin, Andrew Torrance
Abstract:The principle of stereopsis involves measuring an object’s geometry from a pair of images taken at slightly different viewing positions. This...
465
Showing 71 to 80 of 124 Paper Titles