Paper Title:
Electrochemical Corrosion Behavior of Cu-15Ni-8Sn Alloy in Marine Microbial Medium
  Abstract

A comparative study of the corrosion behavior of the copper-nickel-tin alloy in a nutrient–rich simulated seawater-based nutrient-rich medium in the presence and the absence of the marine bacteria was carried out by electrochemical experiments, microscopic methods. Comparing to the corresponding control samples, the electrochemical data demonstrated that the presence of the bacteria accelerated the corrosion of the alloy. Scanning electron microscopy (SEM) images revealed the occurrence of micro-pitting and intergranular corrosion underneath the biofilm on the alloy surface.

  Info
Periodical
Advanced Materials Research (Volumes 79-82)
Edited by
Yansheng Yin and Xin Wang
Pages
1099-1102
DOI
10.4028/www.scientific.net/AMR.79-82.1099
Citation
Y. H. Lei, Y. S. Yin, C. H. Liu, X. T. Chang, Y. Chen, S. Cheng, "Electrochemical Corrosion Behavior of Cu-15Ni-8Sn Alloy in Marine Microbial Medium", Advanced Materials Research, Vols. 79-82, pp. 1099-1102, 2009
Online since
August 2009
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