Paper Title:
Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing
  Abstract

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

  Info
Periodical
Advanced Materials Research (Volumes 79-82)
Edited by
Yansheng Yin and Xin Wang
Pages
1579-1582
DOI
10.4028/www.scientific.net/AMR.79-82.1579
Citation
C. C. Wang, G. H. Min, S. B. Kang, "Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing", Advanced Materials Research, Vols. 79-82, pp. 1579-1582, 2009
Online since
August 2009
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Price
$32.00
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