Paper Title:
Influences of Pretreatment Solution Concentrations on Copper-Doped SiC Particles Made through Electroless Plating Technique
  Abstract

. Pretreatments for copper-doped SiC particles made by an electroless-plating technique, the preconditions to attain good coatings, were conducted in order to obtain the active and clean surface of SiC particles. An orthogonal experiment method was used to determine the concentration of every pretreatment solution. The morphologies of the coatings were observed in a scanning electronic microscope(SEM), the composition of the coatings was analyzed by an energy-dispersive X-ray analysis (EDS), and the phases in the coatings were identified by a X-ray differtometer (XRD). The influences of pretreatment solution concentrations on the copper coatings quality of SiC particles were dealt with. The results showed that the pretreatment solution concentrations had great influences on the coatings quality of SiC particles. The obvious effects on the copper coatings derived from the coarsening solution concentration. The optimized copper coatings of SiC particles were uniform and dense, no bare SiC particles were seen and the interfaces between SiC and Cu bonded well. The high quality and low cost coatings were also obtained after the expensive PaCl2 activating agent had been substituted for AgNO3.

  Info
Periodical
Advanced Materials Research (Volumes 79-82)
Edited by
Yansheng Yin and Xin Wang
Pages
1739-1742
DOI
10.4028/www.scientific.net/AMR.79-82.1739
Citation
M. Hu, Y. F. Su, M. Z. Wu, "Influences of Pretreatment Solution Concentrations on Copper-Doped SiC Particles Made through Electroless Plating Technique", Advanced Materials Research, Vols. 79-82, pp. 1739-1742, 2009
Online since
August 2009
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