Paper Title:
Experimental Models for Assessment of Interfacial Heat Transfer in Dip Soldering
  Abstract

The success of a numerical simulation for solder solidification during soldering processes depends on an accurate knowledge of heat transfer phenomenon at the solder/substrate interface. Two experimental setups were designed to study the interfacial heat transfer at solder/substrate interface. In the first method, a cylindrical probe of substrate material was dipped in liquid solder and solder was allowed to solidify around the metal probe. In the second method the test probe was dipped in the bulk solder liquid of sufficiently large quantity and allowed to attain the surrounding solder liquid temperature. Temperature at the center of the probe was measured using thermocouple. Heat flux transients at the surface of the probe were estimated by lumped heat capacitance method. SEM study at the solder/substrate interfacial region for experiments of solidifying solder around the test probe revealed the existence of a clear gap with aluminum substrate. A conforming contact was obtained with copper substrate. The nature of heat flux transients was found to be different in two experiments.

  Info
Periodical
Advanced Materials Research (Volumes 83-86)
Edited by
M. S. J. Hashmi, B. S. Yilbas and S. Naher
Pages
1228-1235
DOI
10.4028/www.scientific.net/AMR.83-86.1228
Citation
S. Nyamannavar, K. N. Prabhu, "Experimental Models for Assessment of Interfacial Heat Transfer in Dip Soldering", Advanced Materials Research, Vols. 83-86, pp. 1228-1235, 2010
Online since
December 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yan Jin, Zhi Bing Tian
Abstract:Because the dynamic soft reduction of continuous casting process is based on the computation of the solidification end point, using model to...
3936
Authors: Surakan Sunyadeth, Pun Wirot, Boonrat Lohwongwatana, Ratchatee Techapiesancharoenkij
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:The soldered bonding between the Sn-Zn-Cu-Bi system and a Cu substrate was studied and reported herein. The alloying compositions were varied...
26
Authors: Roman Koleňák, Igor Kostolný, Daniel Dřímal, Andrej Rabatin
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:The aim of research consisted in the study of wettability of Sn-based solders on ceramic Al2O3 material by heating with...
87
Authors: Roman Koleňák, Igor Kostolný, Pavol Šebo
Chapter 5: Materials and Technologies for Micro- and Optoelectronics
Abstract:The work deals with the research of wettability of lead-free solders for higher application temperatures. For the research of wettability,...
190