Paper Title:
CAE Analysis of the Big-Size Injection Mold of Rear Bumper
  Abstract

The MPI/Cool analysis module is used to simulate and analyze the cooling system of the car’s bumper. After improvement, a comparably reasonable cooling system is designed. The situation of curling and warping of the formed bumper parts is simulated and analyzed through the MPI/Warp analysis module, the cause of the excessive warpage in the formed parts is found out and relative solutions are put forward. The forming technology of injection mold is optimized and the problem of excessive warpage is resolved.

  Info
Periodical
Advanced Materials Research (Volumes 87-88)
Edited by
Lianxiang Ma, Chuangsheng Wang and Weimin Yang
Pages
375-380
DOI
10.4028/www.scientific.net/AMR.87-88.375
Citation
Q. Z. Yin, R. K. Song, X. Zhang, B. Qi, "CAE Analysis of the Big-Size Injection Mold of Rear Bumper", Advanced Materials Research, Vols. 87-88, pp. 375-380, 2010
Online since
December 2009
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Price
$32.00
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