Paper Title:
The Evolution of Transversal Surface Defects in the Axisymmetric Drawing of Copper Bars
  Abstract

Surface defects are an inevitable characteristic of the raw material employed in the drawing of copper wires. These defects may cause problems in the processing of the material, both during the drawing down to wires and in the final manufacturing of artifacts with the produced wire. The literature reports few analyses covering the importance of these initial defects, as well as concerning their evolution or eventual healing during the drawing. The present paper presents such an analysis for a 12.7 mm diameter copper bar displaying artificial defects 1mm wide and 0.3mm deep. Low angle drawing led to the almost complete healing of the defect after three drawing passes with a 10% reduction of area each. The use of a high semi-angle die led to a completely different situation, where no such defect healing was observed.

  Info
Periodical
Advanced Materials Research (Volumes 89-91)
Edited by
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Pages
142-146
DOI
10.4028/www.scientific.net/AMR.89-91.142
Citation
F. de Castro Magalhães, A. E. de Melo Pertence, H. Béria Campos, M. T. Paulino Aguilar, P. R. Cetlin, "The Evolution of Transversal Surface Defects in the Axisymmetric Drawing of Copper Bars", Advanced Materials Research, Vols. 89-91, pp. 142-146, 2010
Online since
January 2010
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Price
$32.00
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