Paper Title:
Analysis of Residual Stress-Texture Relationships in Thin Films
  Abstract

A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.

  Info
Periodical
Advanced Materials Research (Volumes 89-91)
Edited by
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Pages
425-430
DOI
10.4028/www.scientific.net/AMR.89-91.425
Citation
M. Ortolani, C. L. Azanza Ricardo, P. Scardi, "Analysis of Residual Stress-Texture Relationships in Thin Films", Advanced Materials Research, Vols. 89-91, pp. 425-430, 2010
Online since
January 2010
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Price
$32.00
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