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Measurement of Micro Residual Stresses Near the Grain Boundary in Copper Bicrystal

Journal Advanced Materials Research (Volumes 89 - 91)
Volume THERMEC 2009 Supplement
Edited by T.Chandra, N.Wanderka, W.Reimers , M.Ionescu
Pages 515-520
DOI 10.4028/www.scientific.net/AMR.89-91.515
Citation Ayumi Shiro et al., 2010, Advanced Materials Research, 89-91, 515
Online since January, 2010
Authors Ayumi Shiro, Takao Hanabusa, Tatsuya Okada, Masayuki Nishida, Kazuya Kusaka, Osamu Sakata
Keywords Bicrystal, Crystal Deformation, Micro Residual Stress, Synchrotron Radiation (XRD)
Abstract

Residual stresses near the grain boundary of a bicrystal were measured by synchrotron radiation of SPring-8 at Japan Synchrotron Radiation Research Institute. A copper bicrystal specimen with a 90-degree tilt boundary was deformed 30% in tension. After the plastic extension, kink bands developed in a deformed matrix along the grain boundary. In this study, we focused on the residual stresses in the deformed matrix and the kink band. Residual stresses were evaluated by the X-ray single crystal measurement method. Stereographic projections were used to determine crystal orientations of deformed regions. Our observation showed that crystal orientations were different between the deformed matrix and the kink band. Residual stresses in the direction along the grain boundary in the deformed matrix and kink band were compressive. Residual stresses in the direction vertical to the grain boundary were seen opposite between the deformed matrix and the kink band.

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