Paper Title:
Preparation of Silica Abrasives from Water Glass and Application in Silicon Wafer Polishing
  Abstract

Chemical mechanical polishing technique is more frequently adopted for planarization in integrated circuit fabrication. The silica abrasives in colloidal state are fabricated with the sodium silicate solution as raw materials through the polymerization reaction among silicic acid molecules. By continuous injection of silicic acid into the preexisting silica solution, the diameter of silica nanoparticles increases. The different sized silica nanoparticles are imaged by scanning electron microscopy, and the dried silica are characterized by X-ray diffraction and thermal analysis. The polishing test on silicon wafer with as-fabricated silica abrasives shows that the surface flatness reaches 1.1 nm roughness, however, micro scratches are still present in the surface.

  Info
Periodical
Edited by
Yuexin Han
Pages
183-187
DOI
10.4028/www.scientific.net/AMR.92.183
Citation
X.K. Hu, Z. T. Song, H.B. Wang, W.L. Liu, F. Qin, Z.F. Zhang, "Preparation of Silica Abrasives from Water Glass and Application in Silicon Wafer Polishing", Advanced Materials Research, Vol. 92, pp. 183-187, 2010
Online since
January 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: V.D. Heydemann, W.J. Everson, Rick D. Gamble, David Snyder, Marek Skowronski
805
Authors: Xue Feng Xu, H.F. Chen, H.T. Ma, B.X. Ma, Wei Peng
Abstract:In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. Zeta potential of polymer...
231
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Xiu Ying Wan, Xin Ning
Abstract:In order to understand the material removal mechanism in the process of chemical mechanical polishing (CMP), the states of abrasives in the...
658
Authors: Yong Guang Wang, Liang Chi Zhang
Abstract:Chemo-mechanical polishing (CMP) has been a useful method to produce superior brittle wafer surfaces. This paper reviews the CMP of silicon...
429
Authors: Yang Chen, Wei Bin Mu, Zhao Fang Tang, Ya Juan Zhu, Zhi Gang Chen
Chapter 1: Materials Design
Abstract:CeO2 nanoparticles were synthesized by homogeneous precipitation in mixed solvent of alcohol and deionized water under microwave...
376