Main Theme:

Manufacturing Science and Engineering I

Volumes 97 - 101
doi: 10.4028/www.scientific.net/AMR.97-101
Paper Titles published in this Main Theme:
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Committees

Preface

Blade Diamond Disk for Conditioning CMP Polishing Pad

Authors: Ming Yi Tsai

3

Three-Point Bending Test Behaviour of a QFN Semiconductor Package

Authors: Shahrum Abdullah, Mohd Faridz Mod Yunoh, Azman Jalar

7

Structural and Optical Properties of Dy Doped ZnO Film Grown by RF Magnetic Sputter

Authors: Chun Yu Zhang, Zhiang Jiang, Zhi Guo Wu, Jiang Tao Chen, Peng Xun Yan, Jun Wang

11

The Progress of Fixed Abrasive Wire Saws in the Last Decade

Authors: Chun Yan Yao, Ming Huan Wang, Wei Peng

15

Photocatalytic Analysis and Characterization of Zn2SnO4 Nanoparticles Synthesized via Hydrothermal Method with Na2CO3 Mineralizer

Authors: Yu Shiang Wu, Wen Ku Chang, Min Jou

19

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

Authors: Zainudin Kornain, Azman Jalar, Rozaidi Rashid, Shahrum Abdullah

23

The Crystal Structural Properties of Sputtered ZnO Films Containing Internal Stress

Authors: Bo Huang, Guan Nan He, Hui Dong Yang

28

The Comparison Research of Two Working Electrodes in Electrochemical Reduction of Silicon Tetrachloride

Authors: Wen Liu, Qiu Ping Ma, Jing Yan Guo, Bao Cheng Wang, Qing Sen Meng

32

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