Paper Title:
The Numerical Simulation of Co-Curing Process for AGS Plate
  Abstract

This article demonstrates the co-curing process for AGS plate. Based on the phenomenological models of resin flow and cure kinetic, the variations of temperature, cure degree and pressure were illustrated during the process by a 2D FEA program. Some valuable results were obtained that the distribution of coupling fields could be more uniform with a proper cure cycle and mold, and the resin flow action would be completed in 6000s since the pressure was applied.

  Info
Periodical
Advanced Materials Research (Volumes 97-101)
Edited by
Zhengyi Jiang and Chunliang Zhang
Pages
1764-1767
DOI
10.4028/www.scientific.net/AMR.97-101.1764
Citation
Q. Z. Huang, M. F. Ren, H. R. Chen, "The Numerical Simulation of Co-Curing Process for AGS Plate", Advanced Materials Research, Vols. 97-101, pp. 1764-1767, 2010
Online since
March 2010
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Price
$32.00
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