Paper Title:
Analytical Model of Thermal Stress for Encapsulation and Service Process of Solar Cell Module
  Abstract

A significant challenge in encapsulation process of solar cell module is to reduce breakage rates. In encapsulation and service process of the solar cell module, since the mismatch of heat expansion coefficients of various materials, and temperature difference of material interface in service of module, the residual stresses is caused in each material layer of solar cell module. Analytical model was established to analyze the distribution of temperature and residual stress in encapsulation and service process of the solar cell module. The validity of the analytical model is verified by comparing with finite element method (FEM) results. The residual stresses are obtained during encapsulation of solar cell module, and the thermal stress is reverse in encapsulation and service process of the solar cell module. The effect of thermal stress on structure strength of solar cell module is discussed in detail.

  Info
Periodical
Advanced Materials Research (Volumes 97-101)
Edited by
Zhengyi Jiang and Chunliang Zhang
Pages
2699-2702
DOI
10.4028/www.scientific.net/AMR.97-101.2699
Citation
G. H. Sun, S. L. Yan, G. Chen, "Analytical Model of Thermal Stress for Encapsulation and Service Process of Solar Cell Module", Advanced Materials Research, Vols. 97-101, pp. 2699-2702, 2010
Online since
March 2010
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Price
$32.00
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