Paper Title:
Blade Diamond Disk for Conditioning CMP Polishing Pad
  Abstract

A diamond conditioner or dresser is needed to regenerate the asperity structure of the pad and recover its designed ability in chemical mechanical polishing (CMP) process. In this paper a new design of diamond conditioner is made by shaping a sintered matrix of polycrystalline diamond (PCD) to form teethed blades. These blades are arranged and embedded in epoxy resin to make a designed penetration angle, called the blade diamond disk. The dressing characteristics of pad surface textures are studied by comparison with conventional diamond conditioner. It is found that the height variation of the diamond tip of blade diamond disk is significantly smaller than the conventional diamond disk. The dressing rate of blade diamond disk is lower than that of the conventional diamond disk, and hence the pad life is prolonged. As a result, reduction of the cost CMP is expected. In addition the pad surface roughness Ra of about 3.79μm is less than Ra of about 4.15μm obtained after dressing using a conventional diamond disk.

  Info
Periodical
Advanced Materials Research (Volumes 97-101)
Edited by
Zhengyi Jiang and Chunliang Zhang
Pages
3-6
DOI
10.4028/www.scientific.net/AMR.97-101.3
Citation
M. Y. Tsai, "Blade Diamond Disk for Conditioning CMP Polishing Pad", Advanced Materials Research, Vols. 97-101, pp. 3-6, 2010
Online since
March 2010
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ying Ning Hu, Cheng Yong Wang, H.N. Ding, Z.W. Wang
Abstract:The wear mechanism of several kinds of diamond circular saw blades was studied in the different sawing parameters during dry cutting of...
315
Authors: Xin Wei, Rui Wei Huang, Shao Hui Lai, Z.H. Xie
Abstract:ID (inner-diameter) slicing is widely used in cutting ingots currently. In this paper, the deflection (axial vibration) and vibration...
641
Authors: Rong Hwei Yeh, T.M. Chao, Cheng Kuo Lee, A.H. Tan
Chapter 2: Material Processing Technologies
Abstract:A nanoscale polish process with improved desired characteristics of low roughness and low scratch counts has been developed using a novel...
416
Authors: Matthias Ophey, Christoph Löpenhaus, Fritz Klocke
Chapter 2: Cutting and Finishing Operations
Abstract:One research objective for generating gear grinding is to increase economic efficiency and productivity of the process. Furthermore, the gear...
228