Effective calculated method of temperature field analysis was studied on the hot plate by CAE technologies. It provides design method and heating process for the mold. According to the specificity of hot plate, reasonable location of the thermocouple is discussed, power distribution and layout are designed, heating process of the hot plate is studied, so that hot plate temperature reaches the specified temperature and distributes. Feasible scheme has been got by computer simulation and the result is verified by experiment. The two problems of the temperature control precision and surface thermal field has been solved.