Paper Title:
Dynamic Analysis of Optical Brittle Crystal Slicing by Using Wiresaw
  Abstract

In recent years, wire sawing is considered to be a potentially better technology of slicing brittle crystals especially semiconductor, owing to the unmatched advantages of slicing large ingot into thin wafers with high efficiency, fine quality and less kerf loss. This paper analyses the dynamic effect on wire from a variety of excitation and mechanical structure in the process of cutting on the basis of the effects of vibration on slicing wafer quality. A suitable model is built according to Hamilton principle, closed form expressions is present for the steady state response using finite element method. The relation between inherent characteristics of wiresaw and different system parameters is obtained.

  Info
Periodical
Advanced Materials Research (Volumes 97-101)
Edited by
Zhengyi Jiang and Chunliang Zhang
Pages
45-48
DOI
10.4028/www.scientific.net/AMR.97-101.45
Citation
Y. B. Feng, T. Sun, "Dynamic Analysis of Optical Brittle Crystal Slicing by Using Wiresaw", Advanced Materials Research, Vols. 97-101, pp. 45-48, 2010
Online since
March 2010
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