Paper Title:
Three-Point Bending Test Behaviour of a QFN Semiconductor Package
  Abstract

This paper discusses some issues in micromechanical property of a newly developed Quad Flat No-lead (QFN) 3D stacked die package using three-point bending test approach. The relevant test methodologies were carried out in order to observe the flexural stress, strain, maximum load and deflection of the package. While performing the test, these QFN packages were positioned on the three points test bench, and the specific applied load was then applied and moved down until the package was clearly bent and broken. The related findings indicated that the maximum load was found to be at 251.52 N and the maximum deflection was obtained at 0.41 mm. The results were important for setting related testing parameters (load, stress and strain) before applying the three point cyclic bending test on the QFN stacked die package as the future work.

  Info
Periodical
Advanced Materials Research (Volumes 97-101)
Edited by
Zhengyi Jiang and Chunliang Zhang
Pages
7-10
DOI
10.4028/www.scientific.net/AMR.97-101.7
Citation
S. Abdullah, M. F. M. Yunoh, A. Jalar, "Three-Point Bending Test Behaviour of a QFN Semiconductor Package", Advanced Materials Research, Vols. 97-101, pp. 7-10, 2010
Online since
March 2010
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Price
$32.00
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