Paper Title:
New Glass Sealing Method with Lead-Free Solders
  Abstract

We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the glass substrates while the solder-glass interfaces are being activated by friction. The activation is given by a metal plate, which slides through the gap along the edge of the paired glass substrates and brings in the molten solder by capillary-action. A Ti-doped Sn-Zn eutectic solder showed good hermetic sealing of glass. A eutectic In-Sn solder also yielded good joining, especially at low sealing temperatures.

  Info
Periodical
Edited by
P. VINCENZINI
Pages
1604-1607
DOI
10.4028/www.scientific.net/AST.45.1604
Citation
K. Sakaguchi, S. Domi, K. Suganuma, "New Glass Sealing Method with Lead-Free Solders", Advances in Science and Technology, Vol. 45, pp. 1604-1607, 2006
Online since
October 2006
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Price
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