New Glass Sealing Method with Lead-Free Solders |
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| Journal | Advances in Science and Technology (Volume 45) |
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| Volume | 11th International Ceramics Congress |
| Edited by | P. VINCENZINI |
| Pages | 1604-1607 |
| DOI | 10.4028/www.scientific.net/AST.45.1604 |
| Citation | Koichi Sakaguchi et al., 2006, Advances in Science and Technology, 45, 1604 |
| Online since | October, 2006 |
| Authors | Koichi Sakaguchi, Shinjiro Domi, Katsuaki Suganuma |
| Keywords | Friction, Glass, Hermetic Seal, Solder, Vacuum Glazing |
| Abstract | We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the glass substrates while the solder-glass interfaces are being activated by friction. The activation is given by a metal plate, which slides through the gap along the edge of the paired glass substrates and brings in the molten solder by capillary-action. A Ti-doped Sn-Zn eutectic solder showed good hermetic sealing of glass. A eutectic In-Sn solder also yielded good joining, especially at low sealing temperatures. |
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