Paper Title
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Authors: A. Duckham, J. Levin, T.P. Weihs
Abstract:This paper reviews a new, low-temperature process for soldering and brazing ceramics to metals that is based on the use of reactive...
1578
Authors: Mathieu Brochu, Fabian Edelmann, Robin Valin, Robin A.L. Drew
Abstract:Transient Liquid Phase Bonding (TLPB) is a joining process that uses liquid as medium for the establishment of an interface between two...
1588
Authors: Hiroki Yokoyama
Abstract:Aluminum nitride (AlN) is widely used in the field of electronics because it has high thermal conductivity, good electric and mechanical...
1594
Authors: Koichi Sakaguchi, Shinjiro Domi, Katsuaki Suganuma
Abstract:We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the...
1604
Authors: D. Kalinski, M. Chmielewski, A. Krajewski, M. Kozłowski
Abstract:Reactive sintering of liquid Al with solid Ni resulting in the formation of intermetallic compounds was used for joining parts made of...
1608
Authors: M. Chmielewski, D. Kalinski, K Pietrzak
Abstract:The development of technologies for joining ceramics and metals is connected with an introduction of new ceramic materials and new...
1614
Authors: Hidehiro Yoshida, Koji Morita, Byung Nam Kim, Keijiro Hiraga, Takahisa Yamamoto, Yuichi Ikuhara, Taketo Sakuma
Abstract:High temperature creep and superplastic flow in high-purity oxide ceramics such as alumina and tetragonal zirconia polycrystals is very...
1620
Authors: Marek Boniecki, Rafał Jakieła, Zdzislaw Librant, Wladyslaw Wesolowski, Danuta Dabrowska, Agata Karas
Abstract:The superplastic flow in tetragonal zirconia polycrystals stabilised 3mol% Y2O3 (3YTZP) is strongly affected by the dopant cations, which...
1626
Authors: Hideo Awaji, Seong Min Choi
Abstract:Intra-type nanocomposites, in which nanosized second-phase particles are embedded within matrix grains, generate dislocations around the...
1632
Authors: Tomasz Sadowski, Zdzislaw Librant, Marek Boniecki
Abstract:The aim of the paper is theoretical modelling and experimental verification of the nonsymmetric thermal shock crack propagation in compound...
1640
Showing 231 to 240 of 388 Paper Titles