Paper Title:
Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes
  Abstract

In this paper emphasis is placed on the wet micromachining of silicon micro-arrays constituted by very small holes. Microfabrication of various Silicon plates is performed in a KOH etchant maintained at constant temperature. Limitations due to the process are given. A self elaborated simulator is used to predict etching shapes of several micro holes. A comparison between experiments and simulation is presented.

  Info
Periodical
Edited by
Pietro VINCENZINI and Giuseppe D'ARRIGO
Pages
445-450
DOI
10.4028/www.scientific.net/AST.54.445
Citation
T. G. Leblois, C.R. Tellier, "Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes", Advances in Science and Technology, Vol. 54, pp. 445-450, 2008
Online since
September 2008
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