Paper Title:
Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications
  Abstract

This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

  Info
Periodical
Main Theme
Edited by
Pietro VINCENZINI and Rita PARADISO
Pages
85-94
DOI
10.4028/www.scientific.net/AST.60.85
Citation
T. Linz, R. Vieroth, C. Dils, M. Koch, T. Braun, K. F. Becker, C. Kallmayer, S. M. Hong, "Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications", Advances in Science and Technology, Vol. 60, pp. 85-94, 2008
Online since
September 2008
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$32.00
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