Paper Title:
Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications
| Periodical | Advances in Science and Technology (Volume 60) |
|---|---|
| Main Theme | Smart Textiles |
| Edited by | Pietro VINCENZINI and Rita PARADISO |
| Pages | 85-94 |
| DOI | 10.4028/www.scientific.net/AST.60.85 |
| Citation | Torsten Linz et al., 2008, Advances in Science and Technology, 60, 85 |
| Online since | September, 2008 |
| Authors | Torsten Linz, René Vieroth, Christian Dils, Mathias Koch, Tanja Braun, Karl Friedrich Becker, Christine Kallmayer, Soon Min Hong |
| Keywords | Connectors, Electronics in Textiles, Embroidered Interconnections, Hot Melt Encapsulation, Packaging, Reliability Standards, Reliability Tests, Textile Interconnections, Textile Wiring, Transfer Molding |
| Price | US$ 28,- |
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Abstract
This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.
