Paper Title:
Interfacial Microstructure and Properties of SiC / SiC Joint Brazed with Ag-Cu-Ti Alloys
  Abstract

SiC Ceramic was joined to itself using active brazing Alloys, like Ti in shape of sheet filler of Ag-cu and Ti-6AI-4V. This operation is occurred in an inert gas furnace.Interfacial microstructure studied with Scanning electron microscopy and X-Ray diffraction. Variation of Electrical Specific Resistance measured by 4 pin astute multimeter and strength of these joint was measured by fracture shear loading. This Joint is happened at 900c and upper temperature with 90 minutes and upper time. Electrical specific Resistance goes upper with joint in low temperature & time but this variation is very little. The microstructure showed an excellent bonding at the interfaces. The data showed also that the joining of the SiC decreases with increasing temperature and time.

  Info
Periodical
Edited by
Pietro VINCENZINI, Mark HADFIELD and Alberto PASSERONE
Pages
151-156
DOI
10.4028/www.scientific.net/AST.64.151
Citation
A. H. Ghazi Daryani, A. Nemati, A.H. Kokabi, "Interfacial Microstructure and Properties of SiC / SiC Joint Brazed with Ag-Cu-Ti Alloys", Advances in Science and Technology, Vol. 64, pp. 151-156, 2010
Online since
October 2010
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$32.00
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