Paper Title:
Ultrarapid Transient-Liquid-Phase Bonding of Advanced Ceramics
  Abstract

Interlayer designs and processing conditions that promote rapid and reliable transientliquid- phase (TLP) bonding/joining of Al2O3 and ZrO2-toughened Al2O3 ceramics are presented. The interplay between wetting, roughness, interlayer design and microstructure, and interlayer homogenization is described. The prospects for extending the method to other ceramics, notably the ultrahigh-temperature ceramics (UHTCs) will be discussed.

  Info
Periodical
Edited by
Pietro VINCENZINI, Mark HADFIELD and Alberto PASSERONE
Pages
88-97
DOI
10.4028/www.scientific.net/AST.64.88
Citation
S. M. Hong, C. C. Bartlow, T. B. Reynolds, N. Saito, A. M. Glaeser, "Ultrarapid Transient-Liquid-Phase Bonding of Advanced Ceramics", Advances in Science and Technology, Vol. 64, pp. 88-97, 2010
Online since
October 2010
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Price
$32.00
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